US Patent 12062553 Method of manufacturing semiconductors using fluid delivery system
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US Patent 12062553 Method of manufacturing semiconductors using fluid delivery system
Article
Patent abstract
A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.
Infobox
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Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chris Melcer0
Haruyuki Kubota0
Phillip Ryan Barros0
Randolph Treur0
Todd Mark Cushman0
Date of Patent
August 13, 2024
0Patent Application Number
174951260
Date Filed
October 6, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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