Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yi-Wei Chiu0
Joung-Wei Liou0
Yu Lun Ke0
Date of Patent
September 3, 2024
0Patent Application Number
173507920
Date Filed
June 17, 2021
0Patent Citations
Patent Primary Examiner
Patent abstract
Methods to form low-k dielectric materials for use as intermetal dielectrics in multilevel interconnect systems, along with their chemical and physical properties, are provided. The deposition techniques described include PECVD, PEALD, and ALD processes where the precursors such as TEOS and MDEOS may provide the requisite O-atoms and O
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