US Patent 12080657 Die embedded in substrate with stress buffer
Patent 12080657 was granted and assigned to STMicroelectronics on September, 2024 by the United States Patent and Trademark Office.
Currently, there are no issues on this topic.
Find more entities like US Patent 12080657 Die embedded in substrate with stress buffer
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
