US Patent 12080657 Die embedded in substrate with stress buffer
Patent 12080657 was granted and assigned to STMicroelectronics on September, 2024 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 13, 2023
0
Date of Patent
September 3, 2024
0
Patent Applicant
Patent Application Number
18168319
0
Patent Citations
Patent Inventor Names
Jefferson Sismundo Talledo
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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