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US Patent 12087612 Micro device structure and display apparatus
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Patent
0
Date Filed
September 22, 2021
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Date of Patent
September 10, 2024
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Patent Application Number
17482409
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Patent Citations
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US Patent 7259041 Method for the hermetic encapsulation of a component
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US Patent 7388281 Encapsulated electronic component and production method
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US Patent 7544540 Encapsulated electrical component and production method
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US Patent 7795076 Method, system, and apparatus for transfer of dies using a die plate having die cavities
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US Patent 8580613 Semiconductor chip arrangement with sensor chip and manufacturing method
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US Patent 8791474 Light emitting diode display with redundancy scheme
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US Patent 8809875 Micro light emitting diode
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US Patent 9217541 Stabilization structure including shear release posts
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US Patent 9368683 Printable inorganic semiconductor method
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Patent Inventor Names
Ming-Hsien Wu
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Wei-Hung Kuo
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Yu-Hsiang Chang
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Chu-Yin Hung
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Chu-Li Chao
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12087612
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Patent Primary Examiner
Vu A Vu
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CPC Code
H01L 2933/0066
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H01L 25/167
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H01L 33/0095
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H01L 2221/68363
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H01L 27/156
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H01L 33/486
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H01L 21/6835
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H01L 33/62
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H01L 25/0753
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H01L 2221/68354
0
•••
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