Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
M Ziaul Karim0
Christopher Lane0
Ramakanth Alapati0
Date of Patent
September 10, 2024
0Patent Application Number
184223460
Date Filed
January 25, 2024
0Patent Citations
Patent Primary Examiner
Patent abstract
A method of improving interfacial adhesion of a copper-glass interface in a Through Glass Via (TGV) of an electronic device includes coating an internal wall of a TGV with a curable polymer material having a viscosity less than 30 Poise. The coating is cured to form a dielectric liner having a tensile strength greater than about 8 Mpa and a dielectric loss less than about 0.002. A layer of copper may then be deposited on the dielectric liner.
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