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US Patent 12094843 Antenna in embedded wafer-level ball-grid array package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
August 4, 2022
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Date of Patent
September 17, 2024
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Patent Application Number
17817481
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Patent Citations
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US Patent 8890319 Chip to package interface
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US Patent 9318449 Semiconductor module having an integrated waveguide for radar signals
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US Patent 10211171 Antenna in embedded wafer-level ball-grid array package
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US Patent 9806040 Antenna in embedded wafer-level ball-grid array package
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US Patent 11469191 Antenna in embedded wafer-level ball-grid array package
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US Patent 8288209 Semiconductor device and method of using leadframe bodies to form openings through encapsulant for vertical interconnect of semiconductor die
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US Patent 8786060 Semiconductor package integrated with conformal shield and antenna
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Patent Inventor Names
Aung Kyaw Oo
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Yaojian Lin
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Pandi Chelvam Marimuthu
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Andy Chang Bum Yong
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
12094843
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Patent Primary Examiner
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Jay C Chang
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