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US Patent 12103288 Affixing device
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Patent
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Date Filed
March 26, 2020
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Date of Patent
October 1, 2024
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Patent Application Number
17439188
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Patent Citations
US Patent 10727128 Method of processing a wafer
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US Patent 7438631 Surface-protecting sheet and semiconductor wafer lapping method
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US Patent 9559073 Base film and pressure-sensitive adhesive sheet provided therewith
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Patent Inventor Names
Masao Nogami
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Akimitsu Morimoto
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
12103288
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Patent Primary Examiner
Carson Gross
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CPC Code
B32B 37/0046
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H01L 21/67092
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B32B 37/10
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