Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
January 31, 2017
Patent Application Number
14005574
Date Filed
March 22, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground.
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