US Patent 9559073 Base film and pressure-sensitive adhesive sheet provided therewith
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Patent abstract
To prevent bumps on the circuit side of a bump-bearing wafer from getting crushed when grinding the back side of said wafer while protecting the circuit side with a surface-protection sheet, and also to minimize the formation of dimples and cracks on the side being ground.
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US Patent 09559073 Base film and pressure-sensitive adhesive sheet provided therewith US Patent 9559073 Base film and pressure-sensitive adhesive sheet provided therewith
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Patent Number
0955907300
Patent Number
955907300
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Patent Jurisdiction
Patent Number
095590730
Date of Patent
January 31, 2017
0Patent Application Number
140055740
Date Filed
March 22, 2012
0Official Website
Patent Primary Examiner
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Patent Jurisdiction
Patent Number
095590730
Date of Patent
January 31, 2017
0Patent Application Number
140055740
Date Filed
March 22, 2012
0Official Website
Patent Primary Examiner
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US Patent 09559073 Base film and pressure-sensitive adhesive sheet provided therewith
Infobox
Is a
Patent jurisdiction
Patent number
09559073
Date of patent
January 31, 2017
Patent application number
14005574
Date Filed
March 22, 2012
Patent primary examiner
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