Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Ming-Fa Chen0
Date of Patent
October 8, 2024
0Patent Application Number
181865250
Date Filed
March 20, 2023
0Patent Citations
...
Patent Primary Examiner
Patent abstract
A method includes forming a plurality of dielectric layers, forming a plurality of redistribution lines in the plurality of dielectric layers, etching the plurality of dielectric layers to form an opening, filling the opening to form a through-dielectric via penetrating through the plurality of dielectric layers, forming an insulation layer over the through-dielectric via and the plurality of dielectric layers, forming a plurality of bond pads in the dielectric layer, and bonding a device to the insulation layer and a portion of the plurality of bond pads through hybrid bonding.
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