Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chi-Hsi Wu0
Weiming Chris Chen0
Wen-Hsin Wei0
Chen-Hua Yu0
Hsien-Pin Hu0
Shang-Yun Hou0
Date of Patent
June 11, 2019
0Patent Application Number
157848070
Date Filed
October 16, 2017
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Structures and formation methods of a chip package are provided. The chip package includes a chip stack including a number of semiconductor dies. The chip package also includes a semiconductor chip, and the semiconductor chip is higher than the chip stack. The chip package further includes a package layer covering a top and sidewalls of the chip stack and sidewalls of the semiconductor chip.
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