Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Nianwang Yang0
Hsin-Pin Huang0
Date of Patent
October 29, 2024
0Patent Application Number
174559720
Date Filed
November 22, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
Patent abstract
Embodiments of the present application provide a semiconductor device and a manufacturing method thereof. The semiconductor device includes a semiconductor substrate; an integrated circuit region formed in the semiconductor substrate; and a seal ring arranged in the semiconductor substrate and around the integrated circuit region and configured to protect the integrated circuit region, wherein the seal ring has a wavy structure.
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