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US Patent 12133470 Semiconductor structure and method of forming the same

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Is a

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Patent attributes

Patent Applicant

Taiwan Semiconductor Manufacturing Company

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Chern-Yow Hsu0

Shih-Chang Liu0

Harry-Hak-Lay Chuang0

Kuei-Hung Shen0

Date of Patent

October 29, 2024

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Patent Application Number

180590730

Date Filed

November 28, 2022

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Patent Citations

US Patent 9842986 Semiconductor structure and method of forming the same

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US Patent 9564577 MRAM device and fabrication method

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US Patent 9985075 Dummy bottom electrode in interconnect to reduce CMP dishing

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Patent Primary Examiner

Matthew E Warren

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CPC Code

0

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Patent abstract

The present disclosure provides a semiconductor structure, including an N

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