Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsia-Wei Chen0
Kuei-Hung Shen0
Harry-Hak-Lay Chuang0
Hung Cho Wang0
Date of Patent
December 12, 2017
0Patent Application Number
149696970
Date Filed
December 15, 2015
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure provides a semiconductor structure and a method for manufacturing the same. The semiconductor structure comprises a memory region. The memory region comprises a bottom via, a recap layer on the BV, a bottom electrode on the recap layer, a magnetic tunneling junction layer on the bottom electrode, and a top electrode on the MTJ layer. The material of the recap layer is different from that of the BV.
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