Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Cheng-Chien Li0
Kun-Hsiang Lin0
Shih-Chang Chen0
Date of Patent
November 5, 2024
0Patent Application Number
174688860
Date Filed
September 8, 2021
0Patent Citations
0
...
Patent Primary Examiner
CPC Code
Patent abstract
The present disclosure describes a semiconductor structure including a TSV in contact with a substrate and a metal ring structure laterally surrounding the TSV. The metal ring structure includes one or more metal rings arranged as a stack and one or more metal vias interposed between two adjacent metal rings of the one or more metal rings. The metal ring structure is electrically coupled to the substrate through one or more conductive structures.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.