US Patent 6853067 Microelectromechanical systems using thermocompression bonding
Patent 6853067 was granted and assigned to MICROASSEMBLY TECHNOLOGIES, INC. on February, 2005 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
February 28, 2003
0
Date of Patent
February 8, 2005
0
Patent Application Number
10377999
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Patent Inventor Names
Michael B. Cohn
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Joseph T. Kung
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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