Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Fred C. Redeker0
Robert Steger0
Shijian Li0
Date of Patent
February 22, 2005
0Patent Application Number
103700280
Date Filed
February 18, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Method and apparatus for improving the reproducibility of chucking forces of an electrostatic chuck used in plasma enhanced CVD processing of substrates provides for precoating of the electrostatic chuck with a dielectric layer, such as SiO2, after every chamber cleaning process. The uniform and tightly bonded dielectric layer deposited on the electrostatic chuck eliminates the need for a cover wafer over the chuck surface during the chamber cleaning and provides for more reliable gripping of wafers.
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