Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Lee Melbourne Cook0
David B. James0
John H. V. Roberts0
Date of Patent
March 22, 2005
0Patent Application Number
106598890
Date Filed
September 11, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
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