US Patent 6869350 Polishing pads and methods relating thereto
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Article (+334 characters)
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Patent abstract
This invention describes improved polishing pads useful in the manufacture of semiconductor devices or the like. The pads of the present invention have an advantageous hydrophilic polishing material and have an innovative surface topography and texture which generally improves predictability and polishing performance.
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Patent Inventor Names
David B. James0
John H. V. Roberts0
Lee Melbourne Cook0
Date of Patent
March 22, 2005
0Patent Application Number
106598890
Date Filed
September 11, 2003
0Patent Primary Examiner
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US Patent 6869350 Polishing pads and methods relating thereto
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