Is a
Patent attributes
Patent Applicant
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Naotaka Tanaka0
Ken Okutani0
Masashi Sahara0
Ryo Haruta0
Takashi Nakajima0
Tomoo Matsuzawa0
Yasuyuki Nakajima0
Date of Patent
May 24, 2005
0Patent Application Number
103403070
Date Filed
January 9, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A highly reliable semiconductor device provided herein can prevent a junction between a pad and a wire from coming off, and pads from peeling off an underlying insulating layer on the interface thereof. The semiconductor device has plugs formed in a region in which an electrode pad is formed over a substrate. The plugs protrude into the electrode pad.
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