US Patent 6908832 In situ plasma wafer bonding method
Patent 6908832 was granted and assigned to Silicon Genesis on June, 2005 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
October 6, 2003
0
Date of Patent
June 21, 2005
0
Patent Application Number
10680874
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Patent Citations Received
Patent Inventor Names
Sharon N. Farrens
0
Brian E. Roberds
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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