Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Edward A. Zarbock0
Christopher L. Rumer0
Date of Patent
August 2, 2005
0Patent Application Number
104474930
Date Filed
May 28, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
