US Patent 6924551 Through silicon via, folded flex microelectronic package
Patent 6924551 was granted and assigned to Intel on August, 2005 by the United States Patent and Trademark Office.
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Patent abstract
A microelectronic package including a microelectronic die having through silicon vias extending through a back surface thereof, which allows both an active surface and the back surface of the microelectronic die to have power, ground, and/or input/output signals connected to a flexible substrate. The flexible substrate may further connected to an external substrate through at least one external contact.
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Patent Inventor Names
Christopher L. Rumer0
Edward A. Zarbock0
Date of Patent
August 2, 2005
0Patent Application Number
104474930
Date Filed
May 28, 2003
0Patent Primary Examiner
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US Patent 6924551 Through silicon via, folded flex microelectronic package
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