US Patent 6946384 Stacked device underfill and a method of fabrication
Patent 6946384 was granted and assigned to Intel on September, 2005 by the United States Patent and Trademark Office.
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Patent abstract
Numerous embodiments of a stacked device underfill and a method of formation are disclosed. In one embodiment, a method of forming stacked semiconductor device with an underfill comprises forming one or more layers of compliant material on at least a portion of the top surface of a substrate, said substrate, curing at least a portion of the semiconductor device, selectively removing a portion of the one or more layer of complaint material, and assembling the substrate into a stacked semiconductor device.
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Patent Inventor Names
Grant M. Kloster0
Michael D. Goodner0
Patrick Morrow0
Shriram Ramanathan0
Date of Patent
September 20, 2005
0Patent Application Number
104559340
Date Filed
June 6, 2003
0Patent Primary Examiner
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US Patent 6946384 Stacked device underfill and a method of fabrication
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