US Patent 6946384 Stacked device underfill and a method of fabrication
Patent 6946384 was granted and assigned to Intel on September, 2005 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
June 6, 2003
0
Date of Patent
September 20, 2005
0
Patent Application Number
10455934
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Patent Citations Received
Patent Inventor Names
Grant M. Kloster
0
Michael D. Goodner
0
Patrick Morrow
0
Shriram Ramanathan
0
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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