Is a
Patent attributes
Patent Applicant
0
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Maurice S. Karpman0
Date of Patent
September 20, 2005
0Patent Application Number
103266400
Date Filed
December 19, 2002
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A packaged microchip has a stress sensitive microchip, a package having a package modulus of elasticity, and an isolator between the microchip and the package. The isolator has an isolator modulus of elasticity that has a relationship with the package modulus of elasticity. This relationship causes no more than a negligible thermal stress to be transmitted to the microchip.
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