Patent attributes
A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of which has a dielectric core layer between two electrically conductive foils. One of the layers has one or more openings for securing the embedded RF-chips with a bonding material such as epoxy. The electrically conductive foils on the inner layers can be etched or otherwise removed to form electrical circuits. Micro-vias can be provided through the various layers for interconnecting the electrical circuits and the RF-chips. The electrically conductive foils on the outer layers of the laminated structure can be used to provide electromagnetic shielding to the RF-chips.
