Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideki Ishii0
Koji Bando0
Date of Patent
March 7, 2006
0Patent Application Number
109814720
Date Filed
November 5, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
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