US Patent 7009304 Resin-sealed semiconductor device
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Patent abstract
A resin-sealed semiconductor device has a first semiconductor chip whose circuit surface is bonded to a surface of a die pad. The back surface of a second semiconductor chip is bonded to the back surface of the first semiconductor chip. Each of the semiconductor chips is connected by wire to outer lead respectively. A sealing resin is provided for encapsulating the die pad, the first and second semiconductor chips and the wires so that the other surface of the die pad is exposed.
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Patent Inventor Names
Hideki Ishii0
Koji Bando0
Date of Patent
March 7, 2006
0Patent Application Number
109814720
Date Filed
November 5, 2004
0Patent Primary Examiner
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US Patent 7009304 Resin-sealed semiconductor device
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