US Patent 7018560 Composition for polishing semiconductor layers
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Patent abstract
An aqueous polishing composition comprises a corrosion inhibitor for limiting removal of an interconnect metal with an acidic pH. The composition includes an organic-containing ammonium salt formed with R1, R2, R3 and R4 are radicals, R1 has a carbon chain length of 2 to 15 carbon atoms. The organic-containing ammonium salt has a concentration that accelerates TEOS removal and decreases removal of at least one coating selected from the group consisting of SiC, SiCN, Si3N4 and SiCO.
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Patent Inventor Names
John Quanci0
Zhendong Liu0
Date of Patent
March 28, 2006
0Patent Application Number
106344370
Date Filed
August 5, 2003
0Patent Primary Examiner
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US Patent 7018560 Composition for polishing semiconductor layers
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