Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Seigo Nakamura0
Takashi Hasegawa0
Date of Patent
March 28, 2006
0Patent Application Number
108281800
Date Filed
April 21, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A curable composition comprising (A) an organic polymer having a reactive silicon-containing group, and (B) a block copolymer containing in its molecule one soft segment and at least one hard segment having structural units of an aromatic vinyl monomer. The composition has an improved adhesive property to substrates to which conventional curable compositions comprising an organic polymer having a reactive silicon-containing group are hard to adhere, such as mortar, concrete, fluorocarbon resin coats, EPDM rubber sheet, polyvinyl chloride resin sheet and acrylic resin substrate.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
