US Patent 7019074 Curable composition
Patent 7019074 was granted and assigned to Kaneka Corporation on March, 2006 by the United States Patent and Trademark Office.
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Patent abstract
A curable composition comprising (A) an organic polymer having a reactive silicon-containing group, and (B) a block copolymer containing in its molecule one soft segment and at least one hard segment having structural units of an aromatic vinyl monomer. The composition has an improved adhesive property to substrates to which conventional curable compositions comprising an organic polymer having a reactive silicon-containing group are hard to adhere, such as mortar, concrete, fluorocarbon resin coats, EPDM rubber sheet, polyvinyl chloride resin sheet and acrylic resin substrate.
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Patent Number
Patent Inventor Names
Seigo Nakamura0
Takashi Hasegawa0
Date of Patent
March 28, 2006
0Patent Application Number
108281800
Date Filed
April 21, 2004
0Patent Primary Examiner
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US Patent 7019074 Curable composition
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