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US Patent 7028400 Integrated circuit substrate having laser-exposed terminals

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
June 24, 2003
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Date of Patent
April 18, 2006
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Patent Application Number
10603878
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Patent Citations Received
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US Patent 11931855 Planarization methods for packaging substrates
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US Patent 11881447 Package core assembly and fabrication methods
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US Patent 11887934 Package structure and fabrication methods
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US Patent 11927885 Fluoropolymer stamp fabrication method
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US Patent 12087679 Package core assembly and fabrication methods
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US Patent 11837680 Substrate structuring methods
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US Patent 11862546 Package core assembly and fabrication methods
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Patent Inventor Names
David Jon Hiner
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Ronald Patrick Huemoeller
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Sukianto Rusli
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7028400
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Patent Primary Examiner
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Carl J. Arbes
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