Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jeong Soo Byun0
Ellie Y. Yieh0
M. Ziaul Karim0
Shankar Venkataraman0
Thanh N. Pham0
Zheng Yuan0
Date of Patent
April 25, 2006
0Patent Application Number
108578290
Date Filed
June 1, 2004
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of filling a gap formed between adjacent raised surfaces on a substrate. In one embodiment the method comprises depositing a boron-doped silica glass (BSG) layer over the substrate to partially fill the gap using a thermal CVD process; exposing the BSG layer to a steam ambient at a temperature above the BSG layer's Eutectic temperature; removing an upper portion of the BSG layer by exposing the layer to a fluorine-containing etchant; and depositing an undoped silica glass (USG) layer over the BSG layer to fill the remainder of the gap.
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