Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hideto Kato0
Kazuhiro Arai0
Satoshi Asai0
Date of Patent
June 13, 2006
0Patent Application Number
106396230
Date Filed
August 13, 2003
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An epoxy resin composition comprising (i) a compound having at least two epoxy groups in a molecule as a main component, (ii) a fluorene skeleton-bearing, silicone-modified phenolic resin as a curing agent, and (iii) an organophosphorus compound, amine compound or imidazole compound as a cure accelerator cures into an elastomeric product having a low elasticity, toughness and low dielectric properties.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.