Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tatsuo Kawaguchi0
Ken-ichi Noda0
Date of Patent
August 8, 2006
Patent Application Number
10095290
Date Filed
March 11, 2002
Patent Primary Examiner
Patent abstract
A bonding body includes a first member, a second member and an adhesive layer arranged between the first member and the second member. In the bonding body, the adhesive layer is made of a resin composition having a fluorene skeleton and at least one of the first member and the second member has a thickness of not less than 0.1 μm and not more than 10 μm.
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