US Patent 7087294 Bonding body and method of producing the same
Patent 7087294 was granted and assigned to NGK Insulators on August, 2006 by the United States Patent and Trademark Office.
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Patent Inventor Names
Ken-ichi Noda0
Tatsuo Kawaguchi0
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Patent abstract
A bonding body includes a first member, a second member and an adhesive layer arranged between the first member and the second member. In the bonding body, the adhesive layer is made of a resin composition having a fluorene skeleton and at least one of the first member and the second member has a thickness of not less than 0.1 μm and not more than 10 μm.
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US Patent 07087294 Bonding body and method of producing the same US Patent 7087294 Bonding body and method of producing the same
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Patent Number
07087294
Patent Number
7087294
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Official Website
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US Patent 07087294 Bonding body and method of producing the same
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Is a
Current assignee
Patent jurisdiction
Patent number
07087294
Date of patent
August 8, 2006
Patent application number
10095290
Date Filed
March 11, 2002
Patent primary examiner
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