Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Tue Nguyen0
Date of Patent
August 8, 2006
0Patent Application Number
107959500
Date Filed
March 8, 2004
0Patent Primary Examiner
Patent abstract
A multilayer copper structure has been provided for improving the adhesion of copper to a diffusion barrier material, such as TiN, in an integrated circuit substrate. The multilayer copper structure comprises a thin high-resistive copper layer to provide improved adhesion to the underlying diffusion barrier layer, and a low-resistive copper layer to carry the electrical current with minimum electrical resistance. The invention also provides a method to form the multilayer copper structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
