US Patent 7087522 Multilayer copper structure for improving adhesion property
Patent 7087522 was granted and assigned to Tegal Corporation on August, 2006 by the United States Patent and Trademark Office.
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Patent Inventor Names
Tue Nguyen0
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Patent abstract
A multilayer copper structure has been provided for improving the adhesion of copper to a diffusion barrier material, such as TiN, in an integrated circuit substrate. The multilayer copper structure comprises a thin high-resistive copper layer to provide improved adhesion to the underlying diffusion barrier layer, and a low-resistive copper layer to carry the electrical current with minimum electrical resistance. The invention also provides a method to form the multilayer copper structure.
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US Patent 07087522 Multilayer copper structure for improving adhesion property US Patent 7087522 Multilayer copper structure for improving adhesion property
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Patent Number
070875220
Patent Number
70875220
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Current Assignee
Patent Jurisdiction
Patent Number
070875220
Date of Patent
August 8, 2006
0Patent Application Number
107959500
Date Filed
March 8, 2004
0Official Website
Patent Primary Examiner
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US Patent 07087522 Multilayer copper structure for improving adhesion property
Infobox
Is a
Current assignee
Patent jurisdiction
Patent number
07087522
Date of patent
August 8, 2006
Patent application number
10795950
Date Filed
March 8, 2004
Patent primary examiner
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