US Patent 7090967 Pattern transfer in device fabrication
All edits
Edits on 6 Sep, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Chieh-Yu Lin0
Zhijian Lu0
Edits on 29 Aug, 2023
Golden AI
Edits made to:
Article (+357 characters)
Article
Patent abstract
A method of transferring a pattern onto a substrate, in the fabrication of ICs, is disclosed. The substrate is coated with a photoresist layer, wherein the photoresist layer is selectively exposed and developed, producing sidewalls that exhibit roughness. The roughness is smoothened out by coating the photoresist layer with a coating layer.
Edits on 22 Jul, 2023
Golden AI
Edits made to:
Infobox (-1 properties)
Infobox
Official Website
Edits on 24 May, 2023
Golden AI
Edits made to:
Infobox (+1/-1 properties)
US Patent 07090967 Pattern transfer in device fabrication US Patent 7090967 Pattern transfer in device fabrication
Infobox
Patent Number
070909670
Patent Number
70909670
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
070909670
Date of Patent
August 15, 2006
0Patent Application Number
102482320
Date Filed
December 30, 2002
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Website URL
Edits on 16 Nov, 2021
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 07090967 Pattern transfer in device fabrication
Infobox
Is a
Patent jurisdiction
Patent number
07090967
Date of patent
August 15, 2006
Patent application number
10248232
Date Filed
December 30, 2002
Patent primary examiner
Find more entities like US Patent 7090967 Pattern transfer in device fabrication
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
