A jet clean nozzle having multiple spray openings which increase the scan density of pressurized water sprayed against the surface of a semiconductor wafer. The jet clean nozzle includes a nozzle body for attachment to a nozzle adaptor that communicates with a water jet pump. Multiple spray chambers extend into the nozzle body, and a spray opening communicates with each spray chamber. In use, pressurized water is forced through the respective spray openings and ejected from the spray chambers as multiple water jets.