Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 29, 2006
Patent Application Number
10242797
Date Filed
September 13, 2002
Patent Primary Examiner
Patent abstract
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.
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