US Patent 7097090 Solder ball
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Patent abstract
A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder ball has improved thermal fatigue resistance, good solderability, and good surface brightness after soldering.
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US Patent 07097090 Solder ball US Patent 7097090 Solder ball
Infobox
Patent Number
0709709000
Patent Number
709709000
Edits on 30 Mar, 2023
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Infobox
Is a
Patent Jurisdiction
Patent Number
070970900
Date of Patent
August 29, 2006
0Patent Application Number
102427970
Date Filed
September 13, 2002
0Official Website
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
070970900
Date of Patent
August 29, 2006
0Patent Application Number
102427970
Date Filed
September 13, 2002
0Official Website
Patent Primary Examiner
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US Patent 07097090 Solder ball
Infobox
Is a
Patent jurisdiction
Patent number
07097090
Date of patent
August 29, 2006
Patent application number
10242797
Date Filed
September 13, 2002
Patent primary examiner
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