Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 5, 2006
Patent Application Number
10979418
Date Filed
November 2, 2004
Patent Primary Examiner
Patent abstract
Apparatus and method for testing conductive bumps. The apparatus for testing a plurality of conductive bumps with a single electrical pathway comprises a support substrate and a first probe, a second probe and a plurality of dual-probe sets respectively disposed in the support substrate, wherein each of the dual-probe sets comprises two electrically connected third probes.
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