US Patent 7102372 Apparatus and method for testing conductive bumps
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Patent abstract
Apparatus and method for testing conductive bumps. The apparatus for testing a plurality of conductive bumps with a single electrical pathway comprises a support substrate and a first probe, a second probe and a plurality of dual-probe sets respectively disposed in the support substrate, wherein each of the dual-probe sets comprises two electrically connected third probes.
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US Patent 07102372 Apparatus and method for testing conductive bumps US Patent 7102372 Apparatus and method for testing conductive bumps
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Patent Number
0710237200
Patent Number
710237200
Edits on 3 Apr, 2023
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Is a
Patent Jurisdiction
Patent Number
071023720
Date of Patent
September 5, 2006
0Patent Application Number
109794180
Date Filed
November 2, 2004
0Official Website
Patent Primary Examiner
Edits on 26 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
071023720
Date of Patent
September 5, 2006
0Patent Application Number
109794180
Date Filed
November 2, 2004
0Official Website
Patent Primary Examiner
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US Patent 07102372 Apparatus and method for testing conductive bumps
Infobox
Is a
Patent jurisdiction
Patent number
07102372
Date of patent
September 5, 2006
Patent application number
10979418
Date Filed
November 2, 2004
Patent primary examiner
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