A MEMS device having a support frame positioned on a substrate surrounding a first electrode. A rigid flange portion at the top of the support frame is closely space from, and is connected to, a second electrode by relatively short spring members. RF conductors connected to respective first and second electrodes complete an RF switch. A dielectric layer on the first electrode forms a capacitive type device and includes an electrostatic shield layer on its surface. This electrostatic shield layer is connected to ground by a multi megohm bleeder resistance.