Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 19, 2006
Patent Application Number
10874317
Date Filed
June 24, 2004
Patent Primary Examiner
Patent abstract
The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus includes a vertically movable top ring body for holding the substrate, and an elastic membrane for defining a pressure chamber in the top ring body. A coating is applied to a surface of the elastic membrane which is brought into contact with the substrate.
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