US Patent 7115214 Method of forming barrier layer
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Patent abstract
First, a substrate having at least a conducting layer is provided. Then, a CVD process is performed to form the Ti/TiN barrier layer onto the conducting layer. An examination procedure is followed, and if particles are detected in the Ti/TiN barrier layer, then a rework procedure is performed to remove the Ti/TiN barrier layer and to reform a new Ti/TiN barrier layer.
Edits on 31 Jul, 2023
Golden AI
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Patent Jurisdiction
Patent Number
71152140
Date of Patent
October 3, 2006
0Patent Application Number
107095520
Date Filed
May 13, 2004
0Patent Primary Examiner
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US Patent 07115214 Method of forming barrier layer US Patent 7115214 Method of forming barrier layer
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Patent Number
0711521400
Patent Number
711521400
Edits on 21 May, 2023
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Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071152140
Date of Patent
October 3, 2006
0Patent Application Number
107095520
Date Filed
May 13, 2004
0Official Website
Patent Primary Examiner
Edits on 22 Sep, 2022
Golden AI
Infobox
Is a
Patent Jurisdiction
Patent Number
071152140
Date of Patent
October 3, 2006
0Patent Application Number
107095520
Date Filed
May 13, 2004
0Official Website
Patent Primary Examiner
Edits on 7 Jun, 2022
Golden AI
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Edits on 17 Nov, 2021
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US Patent 07115214 Method of forming barrier layer
Infobox
Is a
Patent jurisdiction
Patent number
07115214
Date of patent
October 3, 2006
Patent application number
10709552
Date Filed
May 13, 2004
Patent primary examiner
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