US Patent 7122082 Silicon wafer and manufacturing method thereof
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Patent Inventor Names
Takaaki Shiota0
Yoshinobu Nakada0
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Patent abstract
A silicon wafer wherein stacking fault (SF) nuclei are distributed throughout the entire in-plane direction, and the density of the stacking fault nuclei is set to a range of between 0.5×108 cm−3 and 1×1011 cm−3.
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US Patent 07122082 Silicon wafer and manufacturing method thereof US Patent 7122082 Silicon wafer and manufacturing method thereof
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Patent Number
071220820
Patent Number
71220820
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Official Website
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Patent Jurisdiction
Patent Number
071220820
Date of Patent
October 17, 2006
0Patent Application Number
107062660
Date Filed
November 13, 2003
0Official Website
Patent Primary Examiner
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US Patent 07122082 Silicon wafer and manufacturing method thereof
Infobox
Is a
Patent jurisdiction
Patent number
07122082
Date of patent
October 17, 2006
Patent application number
10706266
Date Filed
November 13, 2003
Patent primary examiner
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